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Heat thermocompression bonding equipment - TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ

Product Specifications

Maker TRIMECH TECHNOLOGY PTE LTD

Model TM101P-MKⅡ

Category Semiconductor (Post-process)

Model year 2014

External Dimensions W880 W800 H1312

Condition Used

Showroom Information

Exhibition hall Tsuru Technical Center

Price & Inquiry

price Price Inquiry

Inquiry Number K40242

Product Overview

TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ is a used Semiconductor (Post-process) item available from ASKINDEX Korea. External dimensions: W880 W800 H1312. It is kept in stock at our Tsuru Technical Center showroom, so stock checks and price quotations are available immediately. You can also compare other used products from the same manufacturer (TRIMECH TECHNOLOGY PTE LTD) and the same category (Semiconductor (Post-process)).

Mechanical Specifications

With casters

External dimensions: W880 W800 H1312 Weight: Approx. 300kg

Attachments

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TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment - ASKINDEX Korea

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  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea
  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea
  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea
  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea
  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea
  • TRIMECH TECHNOLOGY PTE LTD TM101P-MKⅡ Heat thermocompression bonding equipment Detail Image - ASKINDEX Korea