Automatic visual inspection machine - Nidec Lead Rwi-200
Product Specifications
Maker Nidec Lead
Model Rwi-200
Category Semiconductor (Post-process)
Model year 2018
External Dimensions 1800X1800X1800
Condition Used
Showroom Information
Exhibition hall Kyushu Technical Center
Price & Inquiry
price Price Inquiry
Inquiry Number K50773
Mechanical Specifications
Gold Bump
Solder bump copper bump height
Gold bump top surface unevenness defect
Solder bump outline
High-speed measurement device for bump position and wafer surface defects 6/8 inch orientation flat
Notchable
300 to 1,000 μm
Bump size Gold: 10 to 500 μm wide
Solder, copper bump: diameter φ10 to 750μm
Bump height Gold: 5 to 100 μm
Solder, copper 10 to 100 μm
With 2D/SD inspection optics
Output data TSK format
Report output CSV format
MODEL: RMZ-1133 S/N A000001871
Attachments
Product Overview
Nidec Lead Rwi-200 is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. External dimensions: 1800X1800X1800. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Nidec Lead) and the same category (Semiconductor (Post-process)).
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