Automatic visual inspection machine - Nidec Lead Rwi-200
Product Specifications
Maker Nidec Lead
Model Rwi-200
Category Semiconductor (Post-process)
Model year 2018
External Dimensions 1800X1800X1800
Condition Used
Showroom Information
Exhibition hall Kyushu Technical Center
Price & Inquiry
price Price Inquiry
Inquiry Number K50773
Product Overview
Nidec Lead Rwi-200 is a used Semiconductor (Post-process) item available from ASKINDEX Korea. External dimensions: 1800X1800X1800. It is kept in stock at our Kyushu Technical Center showroom, so stock checks and price quotations are available immediately. You can also compare other used products from the same manufacturer (Nidec Lead) and the same category (Semiconductor (Post-process)).
Mechanical Specifications
Gold Bump
Solder bump copper bump height
Gold bump top surface unevenness defect
Solder bump outline
High-speed measurement device for bump position and wafer surface defects 6/8 inch orientation flat
Notchable
300 to 1,000 μm
Bump size Gold: 10 to 500 μm wide
Solder, copper bump: diameter φ10 to 750μm
Bump height Gold: 5 to 100 μm
Solder, copper 10 to 100 μm
With 2D/SD inspection optics
Output data TSK format
Report output CSV format
MODEL: RMZ-1133 S/N A000001871
Attachments
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