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Wafer Bonding Equipment - Electronic ballast EVG520

Product Specifications

Maker Electronic ballast

Model EVG520

Model year 2005

Condition Used

Showroom Information

Exhibition hall etc

Price & Inquiry

price Price Inquiry

Inquiry Number M40639

Product Overview

Electronic ballast EVG520 is a used test & measurement equipment item available from ASKINDEX Korea. It is kept in stock at our etc showroom, so stock checks and price quotations are available immediately.

Mechanical Specifications

50/60Hz 3-phase 200V

Attachments

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Electronic ballast EVG520 Wafer Bonding Equipment - ASKINDEX Korea

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  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea
  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea
  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea
  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea
  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea
  • Electronic ballast EVG520 Wafer Bonding Equipment Detail Image - ASKINDEX Korea