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Wafer surface inspection equipment - Takano WM-10

Product Specifications

Maker Takano

Model WM-10

Category Semiconductor (Post-process)

Model year 2019

External Dimensions W1272 D1213 H1650

Condition Used

Showroom Information

Exhibition hall Enzan Technical Center

Price & Inquiry

price Price Inquiry

Inquiry Number MA0110

Mechanical Specifications

Features: High-output Violet-LD, maximum detection sensitivity of 48 nm

Ideal for mass production and prototyping of 90 to 65 nm process nodes

Light source: VioletLD

Detection/scanning method: Scattered light detection/spiral scanning method

Scattered light detection/spiral scanning method: Bare 48 nm/Film 60 nm

Wafer size: 300/200mm compatible

Input power: 1φ200-240V 50/60Hz 30A

Attachments

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Product Overview

Takano WM-10 is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. External dimensions: W1272 D1213 H1650. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Takano) and the same category (Semiconductor (Post-process)).

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Takano WM-10 Wafer surface inspection equipment - ASKINDEX Korea

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  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea
  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea
  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea
  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea
  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea
  • Takano WM-10 Wafer surface inspection equipment Detail Image - ASKINDEX Korea