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Wire bonder - Kaijo FB-910

Product Specifications

Maker Kaijo

Model FB-910

Category Semiconductor (Post-process)

Model year 2015

External Dimensions W1140 D1190 H2008

Condition Used

Showroom Information

Exhibition hall Enzan Technical Center

Price & Inquiry

price Price Inquiry

Inquiry Number MB0322

Mechanical Specifications

Wire diameter: Gold wire φ15 to 30 μm

Maximum 3072 wires Maximum 256 multi-chips

Bonding range: X=56mm Y=80mm

Input power: 1φAC200V 50/60Hz

Attachments

View Attached File

Product Overview

Kaijo FB-910 is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. External dimensions: W1140 D1190 H2008. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Kaijo) and the same category (Semiconductor (Post-process)).

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Kaijo FB-910 Wire bonder - ASKINDEX Korea

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  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea
  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea
  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea
  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea
  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea
  • Kaijo FB-910 Wire bonder Detail Image - ASKINDEX Korea