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Flip Chip Bonder - Panasonic FCB3

Product Specifications

Maker Panasonic

Model FCB3

Category Semiconductor (Post-process)

Model year 2005

External Dimensions W1700 D1800 H1920

Condition Used

Showroom Information

Exhibition hall Kyushu Technical Center

Price & Inquiry

price Price Inquiry

Inquiry Number O51034

Mechanical Specifications

Tray size 100x100mm

3φ 200V 50/60Hz

Attachments

View Attached File

Product Overview

Panasonic FCB3 is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. External dimensions: W1700 D1800 H1920. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Panasonic) and the same category (Semiconductor (Post-process)).

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Panasonic FCB3 Flip Chip Bonder - ASKINDEX Korea

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