Wire bonder - Ultrasonic industry URB-412-SA-G
Product Specifications
Maker Ultrasonic industry
Model URB-412-SA-G
Category Semiconductor (Post-process)
Condition Used
Showroom Information
Exhibition hall Enzan Technical Center
Price & Inquiry
price Price Inquiry
Inquiry Number O70014
Mechanical Specifications
Method: Wedge bonding
Wire: Aluminum wire (φ25-50μm)
Bonding speed: 0.35sec/wire
Bonding range: X/Y ±52mm
Power supply: AC100V 50/60Hz
Attachments
Product Overview
Ultrasonic industry URB-412-SA-G is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Ultrasonic industry) and the same category (Semiconductor (Post-process)).
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