Die Bonder - Highsol MODEL-400α
Product Specifications
Maker Highsol
Model MODEL-400α
Category Semiconductor (Post-process)
Model year 2005
External Dimensions W1160 D760 H1600
Condition Used
Showroom Information
Exhibition hall Enzan Technical Center
Price & Inquiry
price Price Inquiry
Inquiry Number PC0352
Mechanical Specifications
Takt time: 30 seconds
Typical chip size: 0.3 x 0.3 t0.2mm
Minimum: 0.3×0.3 t0.2mm
Max:Array
Maximum wafer size: 4 inches
Wafer thickness tolerance: within ±0.02 mm
Pressurized air: 5kg/cm² Inlet diameter: 6mm
Power supply: Single-phase AC100V 50/60Hz 2A
Attachments
Product Overview
Highsol MODEL-400α is a used Semiconductor (Post-process) item handled by ASKINDEX Korea. External dimensions: W1160 D760 H1600. This listing has sold, but you can ask about restock or a similar unit, and request a quote. You can also compare other used products from the same manufacturer (Highsol) and the same category (Semiconductor (Post-process)).
※ Click on the image below to zoom in.